在cf4等离子体处理的AlGaN表面制备的AlGaN/GaN hemt的电学特性

Y. Sakaida, H. Tokuda, M. Kuzuhara
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引用次数: 0

摘要

在这项工作中,我们通过将AlGaN表面暴露在CF4等离子体中,研究了AlGaN/GaN hemt的阈值电压转移机制。CF4等离子体处理AlGaN/GaN异质结构导致二维电子气体密度降低。对AlGaN表面的仔细观察表明,CF4等离子体暴露后,AlGaN表面有轻微的蚀刻。ns的下降速率远远大于假设表面AlGaN蚀刻时计算的ns的下降速率,这表明氟离子注入到AlGaN表面层的影响也使AlGaN/GaN异质结构的阈值电压发生了位移。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Electrical characterization of AlGaN/GaN HEMTs fabricated on CF4-plasma-treated AlGaN surface
In this work, we have studied the mechanism of the threshold voltage shift for AlGaN/GaN HEMTs by exposing the AlGaN surface to CF4 plasma. The CF4 plasma treatment on AlGaN/GaN heterostructures resulted in the decrease in two-dimensional electron gas density. Careful observation on the AlGaN surface indicated that the AlGaN surface was slightly etched after CF4 plasma exposure. The rate of ns decrease was much larger than that calculated by assuming surface AlGaN etching, indicating that the threshold voltage of the AlGaN/GaN heterostructure was also shifted by the effects of F ion implantation into the AlGaN surface layer.
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