SOI上超高性能SiGe HBT器件的研究

T. Thibeault, E. Preisler, Jieyin Zheng, Li Dong, S. Chaudhry, S. Jordan, M. Racanelli
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引用次数: 5

摘要

作者首次在SOI衬底上研究了FT>200GHz的SiGe HBTs。与本体器件相比,基于SOI的器件在Ft中表现出约7 Ghz的退化,而Fmax保持在280 Ghz附近。正如预期的那样,Ccs降低了约40%。基于SOI的HBT在安全工作区域的损耗约为0.75 V,但通过增加集电极到深沟槽隔离的间距,将占用面积增加到原来的大块硅HBT占用面积,可以恢复大约一半的损耗。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A study of ultra-high performance SiGe HBT devices on SOI
The authors present a study of SiGe HBTs with FT>200GHz on an SOI substrate for the first time. The devices built on SOI exhibit a degradation of approximately 7 Ghz in Ft as compared with bulk devices while Fmax remains near 280 GHz. As expected, Ccs is reduced by ~ 40%. A loss of about 0.75 V in safe operating area is observed for the HBTs built on SOI, but approximately half of this can be regained by allowing the footprint to increase to the original, bulk-silicon HBT footprint by increasing the spacing from the collector to the deep trench isolation.
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