Jonghan Kim, Jungdal Choi, W. Shin, Dong Jun Kim, H. Kim, K. M. Mang, Sunghoon Ahn, O. Kwon
{"title":"NAND快闪存储器中隧道氮化物的缩小:氮化物的选择和可靠性","authors":"Jonghan Kim, Jungdal Choi, W. Shin, Dong Jun Kim, H. Kim, K. M. Mang, Sunghoon Ahn, O. Kwon","doi":"10.1109/RELPHY.1997.584220","DOIUrl":null,"url":null,"abstract":"The selection of a manufacturable furnace-grown oxynitride process and reliability issues of the scaled tunnel oxide are examined. As the oxide thickness is scaled down, the cycling endurance, read life time and program disturb characteristics in a NAND flash memory with the tunnel oxynitride are improved compared to the conventional dry oxide.","PeriodicalId":193458,"journal":{"name":"1997 IEEE International Reliability Physics Symposium Proceedings. 35th Annual","volume":"247 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-04-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"24","resultStr":"{\"title\":\"Scaling down of tunnel oxynitride in NAND flash memory: oxynitride selection and reliabilities\",\"authors\":\"Jonghan Kim, Jungdal Choi, W. Shin, Dong Jun Kim, H. Kim, K. M. Mang, Sunghoon Ahn, O. Kwon\",\"doi\":\"10.1109/RELPHY.1997.584220\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The selection of a manufacturable furnace-grown oxynitride process and reliability issues of the scaled tunnel oxide are examined. As the oxide thickness is scaled down, the cycling endurance, read life time and program disturb characteristics in a NAND flash memory with the tunnel oxynitride are improved compared to the conventional dry oxide.\",\"PeriodicalId\":193458,\"journal\":{\"name\":\"1997 IEEE International Reliability Physics Symposium Proceedings. 35th Annual\",\"volume\":\"247 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1997-04-08\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"24\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1997 IEEE International Reliability Physics Symposium Proceedings. 35th Annual\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/RELPHY.1997.584220\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1997 IEEE International Reliability Physics Symposium Proceedings. 35th Annual","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/RELPHY.1997.584220","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Scaling down of tunnel oxynitride in NAND flash memory: oxynitride selection and reliabilities
The selection of a manufacturable furnace-grown oxynitride process and reliability issues of the scaled tunnel oxide are examined. As the oxide thickness is scaled down, the cycling endurance, read life time and program disturb characteristics in a NAND flash memory with the tunnel oxynitride are improved compared to the conventional dry oxide.