{"title":"用印刷方法对典型应变计轨迹与其他应变计轨迹进行比较和表征","authors":"J. Quintero, R. Mancosu","doi":"10.1109/ESIME.2010.5464553","DOIUrl":null,"url":null,"abstract":"The measuring of deformation of a strain gage is quite diverse, requiring expertise in areas like mechanical engineering, metrology, design, materials, as well as knowledge of electronic circuits, in order to use them properly. A strain gage can help determine the mechanical properties of a material, which can be obtained in two ways, the first would be by destructive tests where the rupture of the material is reached, i.e., until its destruction. The second method would be by means of nondestructive testing used to determine physical properties of the material, as well as to detect any internal failure. The focus of this paper refers only to destructive mechanical testing, among which are: bending, and traction.","PeriodicalId":152004,"journal":{"name":"2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"59 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2010-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Comparison and characterization of a typical strain gage trace against another using the printed method\",\"authors\":\"J. Quintero, R. Mancosu\",\"doi\":\"10.1109/ESIME.2010.5464553\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The measuring of deformation of a strain gage is quite diverse, requiring expertise in areas like mechanical engineering, metrology, design, materials, as well as knowledge of electronic circuits, in order to use them properly. A strain gage can help determine the mechanical properties of a material, which can be obtained in two ways, the first would be by destructive tests where the rupture of the material is reached, i.e., until its destruction. The second method would be by means of nondestructive testing used to determine physical properties of the material, as well as to detect any internal failure. The focus of this paper refers only to destructive mechanical testing, among which are: bending, and traction.\",\"PeriodicalId\":152004,\"journal\":{\"name\":\"2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE)\",\"volume\":\"59 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2010-04-26\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ESIME.2010.5464553\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ESIME.2010.5464553","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Comparison and characterization of a typical strain gage trace against another using the printed method
The measuring of deformation of a strain gage is quite diverse, requiring expertise in areas like mechanical engineering, metrology, design, materials, as well as knowledge of electronic circuits, in order to use them properly. A strain gage can help determine the mechanical properties of a material, which can be obtained in two ways, the first would be by destructive tests where the rupture of the material is reached, i.e., until its destruction. The second method would be by means of nondestructive testing used to determine physical properties of the material, as well as to detect any internal failure. The focus of this paper refers only to destructive mechanical testing, among which are: bending, and traction.