支持ASEM MCM铸造厂的测试方法

Proceedings., International Test Conference Pub Date : 1994-10-02 DOI:10.1109/TEST.1994.527984

T. Storey, C. Lapihuska, E. Atwood, L. Su

{"title":"支持ASEM MCM铸造厂的测试方法","authors":"T. Storey, C. Lapihuska, E. Atwood, L. Su","doi":"10.1109/TEST.1994.527984","DOIUrl":null,"url":null,"abstract":"MCM testing can be challenging enough when the chip, substrate, and MCM design are within the control of the same company. In the foundry environment, however, even more robust strategies must be adopted. In this paper a test methodology is described which consolidates the various MCM test stages to form a flexible, low-cost, quick turn-around-time test flow.","PeriodicalId":309921,"journal":{"name":"Proceedings., International Test Conference","volume":"102 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-10-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"A test methodology to support an ASEM MCM foundry\",\"authors\":\"T. Storey, C. Lapihuska, E. Atwood, L. Su\",\"doi\":\"10.1109/TEST.1994.527984\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"MCM testing can be challenging enough when the chip, substrate, and MCM design are within the control of the same company. In the foundry environment, however, even more robust strategies must be adopted. In this paper a test methodology is described which consolidates the various MCM test stages to form a flexible, low-cost, quick turn-around-time test flow.\",\"PeriodicalId\":309921,\"journal\":{\"name\":\"Proceedings., International Test Conference\",\"volume\":\"102 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1994-10-02\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings., International Test Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/TEST.1994.527984\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings., International Test Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/TEST.1994.527984","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 3

摘要

当芯片、基板和MCM设计都在同一家公司的控制下时，MCM测试可能具有足够的挑战性。然而，在代工环境中，必须采用更健壮的策略。本文描述了一种测试方法，该方法将各个MCM测试阶段整合在一起，形成一个灵活、低成本、快速的测试流程。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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A test methodology to support an ASEM MCM foundry

MCM testing can be challenging enough when the chip, substrate, and MCM design are within the control of the same company. In the foundry environment, however, even more robust strategies must be adopted. In this paper a test methodology is described which consolidates the various MCM test stages to form a flexible, low-cost, quick turn-around-time test flow.

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Proceedings., International Test Conference

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