先进的建模和优化高性能32nm HKMG SOI CMOS射频/模拟SoC应用

S. Lee, J. Johnson, B. Greene, A. Chou, K. Zhao, M. Chowdhury, J. Sim, A. Kumar, D. Kim, A. Sutton, S. Ku, Y. Liang, Y. Wang, D. Slisher, K. Duncan, P. Hyde, R. Thoma, J. Deng, Y. Deng, R. Rupani, R. Williams, L. Wagner, C. Wermer, H. Li, B. Johnson, D. Daley, J. Plouchart, S. Narasimha, C. Putnam, E. Maciejewski, W. Henson, S. Springer
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引用次数: 16

摘要

我们展示了用于高速数字和RF/模拟片上系统应用的32nm高k金属门(HKMG) SOI CMOS技术的先进建模和优化。为了实现高性能RF/模拟电路设计,我们提出了具有挑战性的器件建模功能及其增强功能。在标称Lpoly下,浮体fet和fet的峰值fT为300GHz, fMAX高于350GHz,具有出色的模型到硬件精度。对于精密模拟电路设计,我们提供了体接触(BC)场效应管和各种无源器件,并对其性能和建模精度进行了协同优化,以突破技术极限,实现最先进的电路,例如28Gb/s串行链路收发器和工作频率高于100GHz的LC-tank VCO。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Advanced modeling and optimization of high performance 32nm HKMG SOI CMOS for RF/analog SoC applications
We demonstrate advanced modeling and optimization of 32nm high-K metal gate (HKMG) SOI CMOS technology for high-speed digital and RF/analog system-on-chip applications. To enable high-performance RF/analog circuit design, we present challenging device modeling features and their enhancements. At nominal Lpoly, floating-body NFET and PFET demonstrate peak fT of 300GHz and fMAX of higher than 350GHz with excellent model-to-hardware accuracy. For precision analog circuit design, body-contacted (BC) FETs and various passives are offered, and their performance and modeling accuracy are co-optimized to push the technology limit and achieve state-of-the-art circuits, e.g., 28Gb/s serial link transceiver and LC-tank VCO operating at higher than 100GHz.
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