S. Lee, J. Johnson, B. Greene, A. Chou, K. Zhao, M. Chowdhury, J. Sim, A. Kumar, D. Kim, A. Sutton, S. Ku, Y. Liang, Y. Wang, D. Slisher, K. Duncan, P. Hyde, R. Thoma, J. Deng, Y. Deng, R. Rupani, R. Williams, L. Wagner, C. Wermer, H. Li, B. Johnson, D. Daley, J. Plouchart, S. Narasimha, C. Putnam, E. Maciejewski, W. Henson, S. Springer
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引用次数: 16
摘要
我们展示了用于高速数字和RF/模拟片上系统应用的32nm高k金属门(HKMG) SOI CMOS技术的先进建模和优化。为了实现高性能RF/模拟电路设计,我们提出了具有挑战性的器件建模功能及其增强功能。在标称Lpoly下,浮体fet和fet的峰值fT为300GHz, fMAX高于350GHz,具有出色的模型到硬件精度。对于精密模拟电路设计,我们提供了体接触(BC)场效应管和各种无源器件,并对其性能和建模精度进行了协同优化,以突破技术极限,实现最先进的电路,例如28Gb/s串行链路收发器和工作频率高于100GHz的LC-tank VCO。
Advanced modeling and optimization of high performance 32nm HKMG SOI CMOS for RF/analog SoC applications
We demonstrate advanced modeling and optimization of 32nm high-K metal gate (HKMG) SOI CMOS technology for high-speed digital and RF/analog system-on-chip applications. To enable high-performance RF/analog circuit design, we present challenging device modeling features and their enhancements. At nominal Lpoly, floating-body NFET and PFET demonstrate peak fT of 300GHz and fMAX of higher than 350GHz with excellent model-to-hardware accuracy. For precision analog circuit design, body-contacted (BC) FETs and various passives are offered, and their performance and modeling accuracy are co-optimized to push the technology limit and achieve state-of-the-art circuits, e.g., 28Gb/s serial link transceiver and LC-tank VCO operating at higher than 100GHz.