电力电子模块(PEBB)解决方案的材料问题

Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces Pub Date : 1997-03-09 DOI:10.1109/ISAPM.1997.581288

A. Lostetter, J. Webster, R. Hoagland, F. Barlow, A. Elshabini-Riad, A. Nelson

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引用次数: 5

摘要

本文概述了一种电力电子构建块(PEBB)模块设计策略，将多芯片模块概念扩展到电力电子应用中。该策略提供了两个功率信号层以及在两个功率层之间的陶瓷基板内包含多个控制层的能力。此外，通过使用直接金属连接到电源器件，消除了线键及其相关限制。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Materials issues for solutions of Power Electronic Building Blocks (PEBB)

This paper outlines a Power Electronic Building Block (PEBB) module design strategy which extends multichip module concepts to power electronics applications. This strategy provides two power signal layers as well as the capability to include a number of control layers, within the ceramic substrate between the two power layers. In addition, wirebonds with their associated limitations are eliminated through the use of direct metal attachment to the power devices.

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Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces

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