开发环境友好(绿色)，热增强模具复合材料(TEMC)的先进封装

International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458) Pub Date : 2000-11-30 DOI:10.1109/EMAP.2000.904147

T. Tan, N. Mogi, L. Yeoh

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引用次数: 4

摘要

本文概述了导热系数(/spl lambda/)高达100/spl times/10/sup -4/ cal/cm/spl middot/s/spl middot/C (4.2 W/m/spl middot/K)的新型模具化合物的开发和性能。氧化铝及氮化铝与氧化铝混合料填充模料的热膨胀系数为/spl sim/10 ppm/K，单侧成型BGAs翘曲量低，抗焊裂性能好。作为“绿色”，这些无卤素和锑的密封剂能够在175/spl度/C下通过高温储存寿命(HTSL)测试超过1000小时。这些特性是通过使用精心挑选的填料系统(高达/spl sim/80vol%)，环氧树脂系统，潜在催化剂和新的“绿色”化合物技术的最佳组合而实现的。目前正在测量板级的热性能指数，如/spl theta//sub ja/值。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Development of environmental friendly (green), thermally enhanced mold compound (TEMC) for advanced packages

This paper outlines the development and performance of a new series of mold compounds with thermal conductivity (/spl lambda/) up to 100/spl times/10/sup -4/ cal/cm/spl middot/s/spl middot/C (4.2 W/m/spl middot/K). The alumina and mixture of aluminum nitride and alumina filled mold compound feature a coefficient of thermal expansion of /spl sim/10 ppm/K, low warpage with one-side molded BGAs and good anti-solder cracking performance. Being "green", these halogen and antimony free encapsulants are able to pass high temperature storage life (HTSL) tests at 175/spl deg/C for more than 1000 hrs. These features are made possible with use of optimum combinations of a carefully selected filler system (up to /spl sim/80vol%), epoxy resin system, latent catalyst and new "green" compound technology. Thermal performance indices such as /spl theta//sub ja/ values at board level are currently being measured.

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International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458)

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