{"title":"基于MEMS的WDM光纤到户系统光调制器的性能和封装意义","authors":"J. A. Walker, J. Ford, N. Basavanhally","doi":"10.1109/ECTC.1997.606232","DOIUrl":null,"url":null,"abstract":"Fabrication and performance of a silicon micromechanical optical modulator are presented. The modulator is expected to be very low cost due to the ease of providing fiber alignment to the large optical window of the device. Two packaging configurations are described which take advantage of this attribute.","PeriodicalId":339633,"journal":{"name":"1997 Proceedings 47th Electronic Components and Technology Conference","volume":"163 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-05-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Performance and packaging implications of a MEMS based optical modulator for WDM fiber-to-the home systems\",\"authors\":\"J. A. Walker, J. Ford, N. Basavanhally\",\"doi\":\"10.1109/ECTC.1997.606232\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Fabrication and performance of a silicon micromechanical optical modulator are presented. The modulator is expected to be very low cost due to the ease of providing fiber alignment to the large optical window of the device. Two packaging configurations are described which take advantage of this attribute.\",\"PeriodicalId\":339633,\"journal\":{\"name\":\"1997 Proceedings 47th Electronic Components and Technology Conference\",\"volume\":\"163 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1997-05-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1997 Proceedings 47th Electronic Components and Technology Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC.1997.606232\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1997 Proceedings 47th Electronic Components and Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.1997.606232","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Performance and packaging implications of a MEMS based optical modulator for WDM fiber-to-the home systems
Fabrication and performance of a silicon micromechanical optical modulator are presented. The modulator is expected to be very low cost due to the ease of providing fiber alignment to the large optical window of the device. Two packaging configurations are described which take advantage of this attribute.