{"title":"MCM已知好模的膜探针技术","authors":"T. Ueno, Y. Kondoh","doi":"10.1109/TEST.1994.527932","DOIUrl":null,"url":null,"abstract":"A new type of membrane probe, which might be called a Universal Membrane Probe (UMP), as a standard Known-Good-Die (KGD) solution for Multichip Module (MCM) manufacture is described. The membrane consists of TAB tape mounted with an array of several thousands micro-bumps. The bumps are connected in a radial pattern and the pitch of the bumps is equal to the pitch of the I/O pads in LSIs. The advantage of this new membrane is that a single wiring pattern is applicable to many die designs without the need for customizing. In this paper, two KGD applications of the new membrane are investigated, one is a wafer probe and the other a burn-in socket.","PeriodicalId":309921,"journal":{"name":"Proceedings., International Test Conference","volume":"31 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-10-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":"{\"title\":\"Membrane probe technology for MCM Known-Good-Die\",\"authors\":\"T. Ueno, Y. Kondoh\",\"doi\":\"10.1109/TEST.1994.527932\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A new type of membrane probe, which might be called a Universal Membrane Probe (UMP), as a standard Known-Good-Die (KGD) solution for Multichip Module (MCM) manufacture is described. The membrane consists of TAB tape mounted with an array of several thousands micro-bumps. The bumps are connected in a radial pattern and the pitch of the bumps is equal to the pitch of the I/O pads in LSIs. The advantage of this new membrane is that a single wiring pattern is applicable to many die designs without the need for customizing. In this paper, two KGD applications of the new membrane are investigated, one is a wafer probe and the other a burn-in socket.\",\"PeriodicalId\":309921,\"journal\":{\"name\":\"Proceedings., International Test Conference\",\"volume\":\"31 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1994-10-02\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"5\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings., International Test Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/TEST.1994.527932\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings., International Test Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/TEST.1994.527932","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A new type of membrane probe, which might be called a Universal Membrane Probe (UMP), as a standard Known-Good-Die (KGD) solution for Multichip Module (MCM) manufacture is described. The membrane consists of TAB tape mounted with an array of several thousands micro-bumps. The bumps are connected in a radial pattern and the pitch of the bumps is equal to the pitch of the I/O pads in LSIs. The advantage of this new membrane is that a single wiring pattern is applicable to many die designs without the need for customizing. In this paper, two KGD applications of the new membrane are investigated, one is a wafer probe and the other a burn-in socket.
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