用于VLSI多芯片系统集成的超导互连

B. Langley, R. Pease
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引用次数: 2

摘要

介绍了微波频率下超导微带线传播常数的制备和测量结果。相速度和穿透深度的测量得出了几个关于使用超导传输线作为片外互连的结论。首先,线路的相速度可以用简单的公式确定,这对互连设计有很大的帮助。相速度的大小主要由有效介电常数决定,除了介电厚度与穿透深度成等次的线外,其相速度有所下降。衰减常数也进行了测量。在2.3 GHz时,即使使用质量较差的薄膜,低温衰减水平也是10-4 dB/cm的2倍。这种低温下的残余衰减水平可能是由介电损耗决定的,因为它与频率成正比;这表明超导体的损耗小于这个水平
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Superconducting interconnects for VLSI multi-chip system integration
Results related to the fabrication and measurement of the propagation constant of superconducting microstrip lines operating at microwave frequencies are presented. The phase velocity and penetration depth measurements lead to several conclusions regarding the use of superconducting transmission lines as off-chip interconnects. First, the line's phase velocity can be determined from simple formulas, which greatly aids in interconnect design. The magnitude of the phase velocity is determined mostly by the effective dielectric constant, except for lines with dielectric thickness on the order of the penetration depth, for which the phase velocity is degraded. Attenuation constant measurements were also done. The low-temperature attenuation level is 2×10-4 dB/cm at 2.3 GHz even though a poor-quality film was used. This residual attenuation level at low temperature is probably dominated by dielectric losses since it is proportional to frequency; this suggests that the superconductor losses are less than this level
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