图像现场升级,提高工具生产率

M. Dahmen, G. Kenyon
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引用次数: 0

摘要

一些半导体工具用于产品的开发,同时在生产中停留很长时间。在工具的使用寿命期间,工艺要求可能会发生变化——例如,由于CD和覆盖层的要求,关键层的光刻可能会变得更加关键。同样的工具现在可以用于非关键层,但生产力始终是重要的。生产率是以每小时硅片(wph)来衡量的,步进器的图像场尺寸在生产率中起着很大的作用。本文的主要贡献是实现了Ultratech 1X步进机上图像场尺寸的增加,使得5X佳能i线缩小步进机和1X Ultratech步进机每小时的晶圆量都有所增加。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Image field upgrade to improve tool productivity
Some semiconductor tools are used for the development of products and at the same time, stay a long time within production. Process requirements may change during the lifetime of a tool - photolithography of critical layers, for example, may get even more critical due to CD and overlay requirements. The same tool may now be used for non-critical layers, but productivity will always be important. Productivity is measured in wafers per hour (wph) and the image field size of a stepper plays a large role in this productivity. The main contribution of this paper is the realization that an increased image field size on an Ultratech 1X stepper gives increased wafers per hour on both a 5X Canon i-line reduction stepper and the 1X Ultratech stepper.
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