热老化后焊点疲劳强度的评定

2005 International Symposium on Electronics Materials and Packaging Pub Date : 2004-07-20 DOI:10.1299/JSMEZAIRIKI.2004.0_253

T. Miyazaki, M. Oomiya, H. Inoue, K. Kishimoto, M. Amagai

{"title":"热老化后焊点疲劳强度的评定","authors":"T. Miyazaki, M. Oomiya, H. Inoue, K. Kishimoto, M. Amagai","doi":"10.1299/JSMEZAIRIKI.2004.0_253","DOIUrl":null,"url":null,"abstract":"Recently, preventing environmental pollutions, leadfree (Pb-free) solders are about to replace tin-lead (Sn-Pb) eutectic solders. Sn-Ag-Cu alloys are leading candidates for lead free solders. In this study, we carried out board level fatigue tests and investigated the fatigue life of several lead free solder joints. Also, the effects of pad finish metals and their thickness were investigated.","PeriodicalId":352550,"journal":{"name":"2005 International Symposium on Electronics Materials and Packaging","volume":"45 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2004-07-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Evaluation of fatigue strength for solder joints after thermal aging\",\"authors\":\"T. Miyazaki, M. Oomiya, H. Inoue, K. Kishimoto, M. Amagai\",\"doi\":\"10.1299/JSMEZAIRIKI.2004.0_253\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Recently, preventing environmental pollutions, leadfree (Pb-free) solders are about to replace tin-lead (Sn-Pb) eutectic solders. Sn-Ag-Cu alloys are leading candidates for lead free solders. In this study, we carried out board level fatigue tests and investigated the fatigue life of several lead free solder joints. Also, the effects of pad finish metals and their thickness were investigated.\",\"PeriodicalId\":352550,\"journal\":{\"name\":\"2005 International Symposium on Electronics Materials and Packaging\",\"volume\":\"45 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2004-07-20\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2005 International Symposium on Electronics Materials and Packaging\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1299/JSMEZAIRIKI.2004.0_253\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2005 International Symposium on Electronics Materials and Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1299/JSMEZAIRIKI.2004.0_253","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 0

摘要

近年来，为了防止环境污染，无铅(Pb-free)焊料即将取代锡铅(Sn-Pb)共晶焊料。Sn-Ag-Cu合金是无铅焊料的主要候选材料。在本研究中，我们进行了板级疲劳试验，并研究了几种无铅焊点的疲劳寿命。此外，还研究了焊盘表面金属及其厚度的影响。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Evaluation of fatigue strength for solder joints after thermal aging

Recently, preventing environmental pollutions, leadfree (Pb-free) solders are about to replace tin-lead (Sn-Pb) eutectic solders. Sn-Ag-Cu alloys are leading candidates for lead free solders. In this study, we carried out board level fatigue tests and investigated the fatigue life of several lead free solder joints. Also, the effects of pad finish metals and their thickness were investigated.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2005 International Symposium on Electronics Materials and Packaging

自引率

0.00%

发文量