T. Liang, J. Magana, K. Chakravorty, Eric M. Panning, Guojing Zhang
{"title":"EUV掩膜基础设施的准备情况和TD和HVM的差距","authors":"T. Liang, J. Magana, K. Chakravorty, Eric M. Panning, Guojing Zhang","doi":"10.1117/12.2202724","DOIUrl":null,"url":null,"abstract":"The industry is transitioning EUV lithography from feasibility phase to technology development. EUV mask infrastructure needs to be prepared to support the technology development and ready to enable the implementation of EUV lithography for production. In this paper, we review the current status and assess the readiness of key infrastructure modules in EUV mask fabrication, inspection and control, and usage in a mask cycle: blank quality and inspection, pattern inspection, defect disposition and repair, pellicle integration, and handling of pelliclized masks.","PeriodicalId":308777,"journal":{"name":"SPIE Photomask Technology","volume":"36 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-11-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"15","resultStr":"{\"title\":\"EUV mask infrastructure readiness and gaps for TD and HVM\",\"authors\":\"T. Liang, J. Magana, K. Chakravorty, Eric M. Panning, Guojing Zhang\",\"doi\":\"10.1117/12.2202724\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The industry is transitioning EUV lithography from feasibility phase to technology development. EUV mask infrastructure needs to be prepared to support the technology development and ready to enable the implementation of EUV lithography for production. In this paper, we review the current status and assess the readiness of key infrastructure modules in EUV mask fabrication, inspection and control, and usage in a mask cycle: blank quality and inspection, pattern inspection, defect disposition and repair, pellicle integration, and handling of pelliclized masks.\",\"PeriodicalId\":308777,\"journal\":{\"name\":\"SPIE Photomask Technology\",\"volume\":\"36 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2015-11-11\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"15\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"SPIE Photomask Technology\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1117/12.2202724\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"SPIE Photomask Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1117/12.2202724","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
EUV mask infrastructure readiness and gaps for TD and HVM
The industry is transitioning EUV lithography from feasibility phase to technology development. EUV mask infrastructure needs to be prepared to support the technology development and ready to enable the implementation of EUV lithography for production. In this paper, we review the current status and assess the readiness of key infrastructure modules in EUV mask fabrication, inspection and control, and usage in a mask cycle: blank quality and inspection, pattern inspection, defect disposition and repair, pellicle integration, and handling of pelliclized masks.
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