一个3G无线网络网关的系统级热设计与测试

Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium Pub Date : 2006-03-14 DOI:10.1109/STHERM.2006.1625200

I. Obinelo

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摘要

一家主要的移动网络专用网关OEM面临着一个令人难以接受的问题:他们的旗舰产品在最初的现场测试中由于过热而失败，那么该如何挽救他们数百万美元的投资和数千小时的开发努力呢?设计一种改进的产品热结构是本文的主题

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System-level thermal design and testing of a 3G wireless network gateway

A major OEM of dedicated gateways for mobile networks was faced with a show-stopping problem: their flagship product was failing during initial field tests due to overheating, so what to do to salvage their multi-million dollar investment and thousands of hours of development effort? The design of an improved thermal architecture for the product is the subject of this paper

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Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium

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