MEMS加速度计有效封装的多学科方法

Jian Wen, V. Sarihan, B. Myers, Gary Li
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引用次数: 4

摘要

微机电系统(MEMS)封装正变得越来越重要,并在MEMS产品的成功商业化中起着重要作用。封装系统应能使MEMS发挥传感功能,同时保护其免受环境干扰,并有助于将产品质量提高到亚ppm水平。我们在SOIC封装中的一个加速度计发生了低ppm的器件断裂。这种MEMS封装的独特之处在于,封装必须保持一定的谐振频率,以保护换能器不被粘住或夹住。同时,封装必须提供可靠和完整的传感器,没有破裂或输出偏移。采用包括振动分析、电响应测定、应力分析和断裂力学在内的多学科方法来确定合适的模具附着材料,以彻底解决器件断裂问题。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A multidisciplinary approach for effective packaging of MEMS accelerometer
Micro-electro-mechanical systems (MEMS) packaging is becoming increasingly critical and plays a major role in the successful commercialization of MEMS product. The packaging system should eable the MEMS perform the sensing function and at the same time protect it from the environmental disturbance, and help improve product quality to the sub-ppm level. One of our accelerometers in an SOIC package experienced a low ppm occurrence of device fracture. This MEMS package is unique in that the package has to maintain a certain resonance frequency to protect the transducer from sticking or clipping. At the same time, the package has to deliver a reliable and intact transducer with no cracking or output offset. A multidisciplinary approach inclusive of vibration analysis, electrical response determination, stress analysis, and fracture mechanics was used to determine the appropriate die attach material to completely resolve the device fracture issue.
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