导电胶粘剂/锡合金界面高温降解机理研究

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) Pub Date : 2001-03-11 DOI:10.1109/ISAOM.2001.916542

E. Suganuma, M. Yamashita

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引用次数: 2

摘要

对ag -环氧导电胶粘剂/Sn-10Pb涂层界面在150/spl℃下热暴露长达1000小时，并通过金相分析考察了界面的降解情况。由于热暴露，Sn从Sn- pb涂层优先扩散到ag -环氧导电胶粘剂层。Ag则没有明显的扩散。Sn-Pb涂层中形成较大空隙，ag -环氧树脂/Sn-Pb涂层界面处形成薄间隙。Ag-环氧层中形成Ag/ sub3 /Sn。在ag -环氧树脂/Sn-Pb涂层界面处，自由表面形成脱粘带。热暴露引起的退化归因于这些事实。提出了一种不失去界面连接的ag -环氧/锡合金镀层的理想界面结构。在电极上，在电极上的扩散阻挡层之后是一层可以在修复温度下熔化的锡合金层，最后是一层防止ag -环氧粘合剂(如Cu或Ni)的阻挡层。

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High temperature degradation mechanism of conductive adhesive/Sn alloy interface

The Ag-epoxy conductive adhesive/Sn-10Pb coating interface was subjected to heat exposure at 150/spl deg/C for up to 1000 hours and the interface degradation was examined by metallurgical analysis. Preferential Sn diffusion from the Sn-Pb coating layer to the Ag-epoxy conductive adhesive layer occurs due to heat exposure. In contrast, Ag does not show any significant diffusion. Large voids are formed in the Sn-Pb coating layer and a thin gap is formed at the Ag-epoxy/Sn-Pb coating layer interface. Ag/sub 3/Sn is formed in the Ag-epoxy layer. A debonding band is formed from the free surface at the Ag-epoxy/Sn-Pb coating interface. The degradation due to heat exposure is attributed to these facts. An ideal interface structure for the Ag-epoxy/Sn alloy coating that does not lose interface connection was proposed. From the electrode, a diffusion barrier layer against the electrode is followed by a Sn alloy layer that can melt at repair temperatures, and finally a barrier layer against Ag-epoxy adhesive such as Cu or Ni is applied.

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Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562)

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