柔性多层衬底的碳纳米管凹凸互连

2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Pub Date : 2014-07-15 DOI:10.1109/LTB-3D.2014.6886162

M. Fujino, H. Terasaka, T. Suga

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引用次数: 1

摘要

将凹凸型垂直排列碳纳米管作为凹凸互连结构放置在柔性衬底上，用于柔性多层衬底。这些结构通过表面活化键合方法进行键合和转移。本文报道了这些结构的制备工艺及其电学和力学性能。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Carbon nanotube bump interconnect for flexible multilayer substrates

Bump shaped Vertically Aligned Carbon Nanotubes as bump interconnect structures was fabricated and located on flexible substrates for flexible multilayer substrates. These structures were bonded and transferred by means of surface activated bonding method. In this paper, the fabrication process and electrical and mechanical properties of these structures is reported.

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2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

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