O. Wittler, R. Mrossko, E. Kaulfersch, B. Wunderle, B. Michel
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Mechanical characterisation of thin metal layers by modelling of the nanoindentation experiment
Obtaining material data for thin metal layers is a mayor issue in the reliability assessment of microelectronic products. Therefore a method for obtaining elastic-plastic material data is analyzed and discussed in this paper. It is based on the nanoindentation of a film on a silicon substrate and the modeling of it. Thus it becomes possible to fit specific material models to the indentation experiment. Results are shown for two AlSiCu layers.
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