G. Czornyj, K.R. Chen, G. Prada-Silva, A. Arnold, K. Souleotis, S. Kim, M. Ree, W. Volksen, D. Dawson, R. DiPietro
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Polyimide for thin film redistribution on glass-ceramic/copper multilevel substrates (ES9000 system)
In 1991 IBM introduced a glass-ceramic substrate with thin-film redistribution as the first level package utilizing copper thin-film technology. The authors describe the development of a unique and novel polyimide, a derivative of PMDA-ODA, used in this substrate. The synthesis, processing, and material characterization are described. The discussion emphasizes the experimental techniques developed to fully characterize thin films (10-20 mu m thick) of polyimide to ensure the manufacturability and reliability of the thin-film redistribution.<>
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