可编程序逻辑阵列的故障定位

Caribbean Way
{"title":"可编程序逻辑阵列的故障定位","authors":"Caribbean Way","doi":"10.1109/TEST.1989.82355","DOIUrl":null,"url":null,"abstract":"In order to ensure the manufacture of large PLA (programmable logic array) chips with reasonable yield level, a design for repairable PLAs (RPLAs) was proposed in which the partially defective chips can be repaired without reconfiguring the external routing. However, before a defective chip can be repaired, the locations of the defects must be precisely identified. The author presents a fault location (diagnosis) scheme that achieves a full diagnosability in locating all single and multiple stuck-at, bridging, and crosspoint faults. Two examples are given to demonstrate the proposed scheme.<<ETX>>","PeriodicalId":264111,"journal":{"name":"Proceedings. 'Meeting the Tests of Time'., International Test Conference","volume":"50 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1989-08-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Fault location in repairable programmable logic arrays\",\"authors\":\"Caribbean Way\",\"doi\":\"10.1109/TEST.1989.82355\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In order to ensure the manufacture of large PLA (programmable logic array) chips with reasonable yield level, a design for repairable PLAs (RPLAs) was proposed in which the partially defective chips can be repaired without reconfiguring the external routing. However, before a defective chip can be repaired, the locations of the defects must be precisely identified. The author presents a fault location (diagnosis) scheme that achieves a full diagnosability in locating all single and multiple stuck-at, bridging, and crosspoint faults. Two examples are given to demonstrate the proposed scheme.<<ETX>>\",\"PeriodicalId\":264111,\"journal\":{\"name\":\"Proceedings. 'Meeting the Tests of Time'., International Test Conference\",\"volume\":\"50 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1989-08-29\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings. 'Meeting the Tests of Time'., International Test Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/TEST.1989.82355\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings. 'Meeting the Tests of Time'., International Test Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/TEST.1989.82355","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2

摘要

为了保证生产出成品率合理的大型可编程逻辑阵列芯片,提出了一种可修复的可编程逻辑阵列(RPLAs)设计方案,该方案可以在不重新配置外部布线的情况下修复部分有缺陷的芯片。然而,在修复有缺陷的芯片之前,必须精确地识别缺陷的位置。作者提出了一种故障定位(诊断)方案,该方案在定位所有单个和多个卡点、桥接和交叉点故障时实现了完全的可诊断性。给出了两个实例来说明所提出的方案。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Fault location in repairable programmable logic arrays
In order to ensure the manufacture of large PLA (programmable logic array) chips with reasonable yield level, a design for repairable PLAs (RPLAs) was proposed in which the partially defective chips can be repaired without reconfiguring the external routing. However, before a defective chip can be repaired, the locations of the defects must be precisely identified. The author presents a fault location (diagnosis) scheme that achieves a full diagnosability in locating all single and multiple stuck-at, bridging, and crosspoint faults. Two examples are given to demonstrate the proposed scheme.<>
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