基于光学高分辨率图像的化合物半导体缺陷检测

2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM) Pub Date : 2023-05-01 DOI:10.1109/IITC/MAM57687.2023.10154802

Thomas Trautzsch, A. Mapelli, Timm Berndorfer, Christian Czogalla, Christoph Pfuhl

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引用次数: 0

摘要

随着体积的增加和对更小、更快、更节能集成电路的需求的增加，化合物半导体已经比硅获得了显著的重要性。在本文中，作者打算描述一种新的实现解决方案，该解决方案基于自动光学检测(AOI)系统获得的高分辨率图像，结合基于人工智能的方法来识别和分类缺陷，以稳定监测化合物半导体的加工过程。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Optical high-resolution image-based defect inspection on compound semiconductors

With the increase in volume and demand for smaller, faster, and more power-efficient integrated circuits, compound semiconductors have gained significant importance over silicon. In this paper, the authors intend to describe a novel implemented solution based on high-resolution images obtained with an automated optical inspection (AOI) system, combined with an artificial intelligence-based approach to identify, and classify defects for the purpose of a stable monitoring of the processing of compound semiconductors.

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来源期刊

2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM)

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