L. Fox, C. Davidson, S. Hansen, K. Brown, A. Ościłowski
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引用次数: 1
摘要
描述了一种高针脚数，高功率TAB(磁带自动键合)到板的VLSI芯片封装。封装包括一个保护性陶瓷翻盖，封装一个TAB芯片，该芯片具有332根125 μ m ILB(内引线键合)间距的引线，不受影响地通过陶瓷外壳延伸到配置用于回流焊接的0.3 mm间距OLB(外引线键合)区域。封装体通过弹簧负载的散热器通过低压可分离接口提供良好的导热性，夹紧在印刷线路板基板上。采用70毫米的单站点滑动载体胶带格式，以方便封装组装，从ILB，模具连接，翻盖粘接，通过测试和老化，最后为OLB加工和引线。经过一系列严格的测试，使该包装符合在VAX4000/300中使用的要求。
A high-pincount, high-power TAB (tape automated bonding) to board VLSI chip package is described. The package consists of a protective ceramic clamshell enclosing a TAB chip with 332 leads at 125 mu m ILB (inner lead bond) pitch extending uninterrupted through the ceramic enclosure to the 0.3-mm pitch OLB (outer lead bond) zone configured for reflow soldering. The package body is clamped to the printed wiring board substrate by a spring-loaded heatsink providing good thermal conductance through a low-pressure separable interface. A 70-mm single site slide carrier tape format is employed to facilitate package assembly from ILB, die attach, clamshell bonding, through test and burn-in, and finally excise and leadform for OLB. A number of rigorous tests were used to qualify the package for use in the VAX4000/300.<>
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