{"title":"统计过程控制技术在回流焊中的应用研究","authors":"Wu Zhao-hua","doi":"10.1109/ICEPT.2005.1564739","DOIUrl":null,"url":null,"abstract":"SPC (statistical process control) does beforehand control for produce process through symbolic statistics. Compared with usual ex-post control, it can reduce loss and decrease failure rate effectively. In this paper, factors of SPC of reflow soldering processes were analyzed; SPC project of reflow soldering processes was confirmed; SPC models of reflow soldering processes were built; SPC of reflow soldering processes was achieved by MINITAB.","PeriodicalId":234537,"journal":{"name":"2005 6th International Conference on Electronic Packaging Technology","volume":"10 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2005-08-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A study on statistical process control technology applied in reflow soldering processes\",\"authors\":\"Wu Zhao-hua\",\"doi\":\"10.1109/ICEPT.2005.1564739\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"SPC (statistical process control) does beforehand control for produce process through symbolic statistics. Compared with usual ex-post control, it can reduce loss and decrease failure rate effectively. In this paper, factors of SPC of reflow soldering processes were analyzed; SPC project of reflow soldering processes was confirmed; SPC models of reflow soldering processes were built; SPC of reflow soldering processes was achieved by MINITAB.\",\"PeriodicalId\":234537,\"journal\":{\"name\":\"2005 6th International Conference on Electronic Packaging Technology\",\"volume\":\"10 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2005-08-30\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2005 6th International Conference on Electronic Packaging Technology\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICEPT.2005.1564739\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2005 6th International Conference on Electronic Packaging Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEPT.2005.1564739","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A study on statistical process control technology applied in reflow soldering processes
SPC (statistical process control) does beforehand control for produce process through symbolic statistics. Compared with usual ex-post control, it can reduce loss and decrease failure rate effectively. In this paper, factors of SPC of reflow soldering processes were analyzed; SPC project of reflow soldering processes was confirmed; SPC models of reflow soldering processes were built; SPC of reflow soldering processes was achieved by MINITAB.
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