IDDQ逻辑漏电的逻辑电路分析及TEM检测

2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Pub Date : 2016-07-18 DOI:10.1109/IPFA.2016.7564279

Ang Chung Keow, Yong Foo Khong

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引用次数: 0

摘要

技术节点的减少使失效分析过程变得困难。概述了IDDQ逻辑漏电故障的电气故障定位方法。在故障定位后，通过TEM进行完整的分析进行识别，并进一步了解故障机制，最终找到根本原因。

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Logic circuit analysis and TEM inspection of IDDQ logic leakage

The decreasing of technology node has made process of failure analysis become difficult. This paper outlines electrical fault localization method on IDDQ logic leakage failure. Upon fault localization, a complete analysis through TEM was performed for identification and further understanding of the failure mechanism eventually led to root cause finding.

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2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

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