{"title":"先进封装用薄膜的机械性能和附着力测量","authors":"M. Shell-De Guzman, M. Hack, G. Neubauer","doi":"10.1109/RELPHY.1994.307849","DOIUrl":null,"url":null,"abstract":"\"Depth-sensing\" ultra micro-indentation is a novel method for measuring the hardness, elastic modulus, and adhesion of films as thin as 0.4 micrometers. Three different techniques can be employed to determine these mechanical properties. The first part of this paper describes each technique. The second part of this paper presents two applications that employ these techniques to measure the properties of various materials used in advanced integrated circuit packages, including polyimide die coat modulus and adhesion, and SnPb solder plate hardness.<<ETX>>","PeriodicalId":276224,"journal":{"name":"Proceedings of 1994 IEEE International Reliability Physics Symposium","volume":"227 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-04-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Mechanical properties and adhesion measurements of films used in advanced packages\",\"authors\":\"M. Shell-De Guzman, M. Hack, G. Neubauer\",\"doi\":\"10.1109/RELPHY.1994.307849\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\\\"Depth-sensing\\\" ultra micro-indentation is a novel method for measuring the hardness, elastic modulus, and adhesion of films as thin as 0.4 micrometers. Three different techniques can be employed to determine these mechanical properties. The first part of this paper describes each technique. The second part of this paper presents two applications that employ these techniques to measure the properties of various materials used in advanced integrated circuit packages, including polyimide die coat modulus and adhesion, and SnPb solder plate hardness.<<ETX>>\",\"PeriodicalId\":276224,\"journal\":{\"name\":\"Proceedings of 1994 IEEE International Reliability Physics Symposium\",\"volume\":\"227 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1994-04-11\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of 1994 IEEE International Reliability Physics Symposium\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/RELPHY.1994.307849\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of 1994 IEEE International Reliability Physics Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/RELPHY.1994.307849","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Mechanical properties and adhesion measurements of films used in advanced packages
"Depth-sensing" ultra micro-indentation is a novel method for measuring the hardness, elastic modulus, and adhesion of films as thin as 0.4 micrometers. Three different techniques can be employed to determine these mechanical properties. The first part of this paper describes each technique. The second part of this paper presents two applications that employ these techniques to measure the properties of various materials used in advanced integrated circuit packages, including polyimide die coat modulus and adhesion, and SnPb solder plate hardness.<>
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