A Hybrid Laser Integration Approach for Miniature Photonic Sensors

Hybrid laser integration with optical MEMS chips and silicon photonic (SiP) circuits are important for many miniature devices, such as micro-sensor, optical transmitter module. Here, we demonstrated a flexible approach for hybrid integrating laser chip onto silicon device by use of flip-chip bonding method to build a MEMS tunable laser and a miniature silicon optical bench (SiOB) for SiP devices. The maximum coupling efficiency is up to 76.5% and 81.5% for these two devices, respectively. It provides a low cost, miniature, and reliable solution for large-scale deployments Place abstract here: usually a single paragraph summarizing the problem, approach, and results that are in the paper.