Modeling and analysis of SSN in silicon and glass interposers for 3D systems

In this paper, an efficient hybrid modeling approach for power delivery network (PDN) with through-silicon vias (TSVs) for 3D systems is proposed. The proposed approach extends multi-layer finite difference method (M-FDM) to include TSVs by extracting their parasitic behavior using an integral equation based solver. Using the proposed modeling technique the power/signal integrity of PDN with TSVs/through-glass vias (TGVs) in lossy silicon interposer and low loss glass interposer is investigated and compared. The comparison indicates the benefits of using silicon interposer for high speed signaling.