利用红外发射显微镜定位HBT功率放大器阵列中的缺陷细胞

Peter Dai, P. Canfield
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引用次数: 2

摘要

提出了解决HBT PA产品故障率极低问题的逻辑方法和途径。红外发射技术与结击穿测量相结合的价值证明了在数百个HBT细胞阵列中识别潜在不良HBT细胞的能力。具有低结击穿特性的HBT细胞被证明是整个PA的潜在杀手。低击穿的原因可能是工艺缺陷或外延层缺陷,也可能是ESD或在一定条件下的反向电压。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Location of defective cells in HBT power amplifier arrays using IR emission microscopy
A logical method and approach to a very low percentage failure rate problem for HBT PA products is presented. The value of the IR emission technique coupled with junction breakdown measurements demonstrated the capability to identify a potentially bad HBT cell contained in an array of a few hundred HBT cells. HBT cells with low junction breakdown characteristics are demonstrated to be a potential killer to the whole PA. The cause of low breakdown can be either process or epi-layer defects, as well as by ESD or reverse voltage under certain conditions.
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