3d打印与电子封装——现状与未来挑战

C. Bailey, S. Stoyanov, T. Tilford, G. Tourloukis
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引用次数: 6

摘要

3d打印或增材制造在过去五年中受到了媒体的广泛关注。许多公司现在正在将材料、设计工具和3d打印机商业化,这些材料、设计工具和3d打印机被用于数字制造的许多领域,包括航空航天、医疗、建筑和消费品。但是3d打印对电子封装和制造有什么影响呢?生产和销售3d打印机的公司以及EDA和MCAD公司现在正在向电子行业推广3d打印。本文详细介绍了3d打印在电子系统制造和包装方面的现状,并提供了一些关于它在未来如何影响我们社区的见解。讨论了与印刷导电材料的性能和电气行为相关的挑战,因为它们必须满足或更好地满足当前使用的材料的性能。当然,任何3d打印电子系统的整体质量和可靠性都必须满足行业要求。本文将详细介绍在设计和建模工具方面发生的发展,以及如何使用这些工具来解决这些挑战。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
3D-printing and electronic packaging - current status and future challenges
3D-Printing, or Additive Manufacturing, has received significant media attention during the last five years. A number of companies are now commercializing materials, design tools, and 3D-Printers and these are being used in a number of sectors for digital manufacturing including aerospace, medical, construction and consumer products. But what impact is 3D-Printing having on electronic packaging and manufacturing? Companies that produce and sell 3D-Printers as well as EDA and MCAD companies are now promoting 3D-Printing towards the electronics sector. This paper details the current status of 3D-printing for the manufacture and packaging of electronic systems, and provides some insights on how it may impact our community in the future. Challenges related to the performance and electrical behavior of printed conductive materials are discussed as they must meet or better the performance of materials currently used. And of course the overall quality and reliability of any 3D-printed electronic system must meet industry requirements. The paper will detail developments taking place in design and modelling tools and how these can be used in addressing some of these challenges.
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