用结合绝缘体上硅(SOI)衬底测定铟和锑在硅中的固溶极限

A. Sato, K. Suzuki, H. Horie, T. Sugii
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引用次数: 7

摘要

SOI衬底使我们能够在离子注入中获得高且均匀的杂质浓度分布,并随后进行高温退火。我们用霍尔测量法评价了In和Sb在Si中的固溶极限。结果表明,在800 ~ 1100℃范围内,In的固溶度为1.5/spl倍/10/sup 18/ cm/sup -3/, Sb的固溶度为7/spl倍/10/sup 19/ cm/sup -3/, 800 ~ 1100℃范围内,Sb的固溶度为1.2/spl倍/10/sup 20/ cm/sup -3/,均高于文献报道的固溶度。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Determination of solid solubility limit of In and Sb in Si using bonded silicon-on-insulator (SOI) substrate
An SOI substrate enables us to obtain high, even distribution of impurity concentration in ion implantation with subsequent high-temperature annealing. We evaluated the solid solubility limit of In and Sb in Si by Hall measurement. We found that the solid solubility of In was constant at 1.5/spl times/10/sup 18/ cm/sup -3/ between 800/spl deg/C and 1100/spl deg/C, while that of Sb varied from 7/spl times/10/sup 19/ cm/sup -3/ at 800/spl deg/C to 1.2/spl times/10/sup 20/ cm/sup -3/ at 1100/spl deg/C, both of which were higher than previously reported values.
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