一种无卤环氧树脂，具有内在阻燃性，用于电子封装

2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) Pub Date : 2016-11-01 DOI:10.1109/EPTC.2016.7861500

Song Kiat Jacob Lim, Jian Rong Eric Phua, Yu Bai, Xiao Hu, C. Gan

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引用次数: 0

摘要

典型的环氧基电子封装材料需要大量添加阻燃添加剂，以满足有关可燃性的法规要求，通常通过UL-94可燃性测试进行评估。传统添加剂如封装红磷，由于其吸湿性，在高湿环境下可能存在可靠性问题，导致电化学迁移引起电短路。一种基于多面体低聚硅氧烷(POSS)结构的非卤化环氧树脂具有固有的阻燃性和优异的高温性能。本研究探讨了利用poss基环氧树脂取代传统环氧树脂作为一种具有增强可靠性的本质阻燃电子封装材料的可行性。

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A halogen-free epoxy with intrinsic flame retardance for use in electronic packaging

Typical epoxy-based electronic packaging materials necessitate substantial inclusion of flame retardant additives in order to satisfy regulatory requirements regarding flammability, usually evaluated by the UL-94 flammability test. Conventional additives such as encapsulated red phosphorus may pose a reliability issue under high humidity environment due to its hygroscopic nature, leading to electrical shorts caused by electrochemical migration. A non-halogenated epoxy based on the Polyhedral Oligomeric Silsesquioxane (POSS) structure possess inherent flame retardance and excellent high temperature properties. This study investigate the feasibility of utilizing POSS-based epoxy to replace conventional epoxies as an intrinsically flame retardant electronic packaging materials with enhanced reliability.

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来源期刊

2016 IEEE 18th Electronics Packaging Technology Conference (EPTC)

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