用于CMP碟形评价的AFM图像中通孔阵列的自动检测

2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM) Pub Date : 2023-05-01 DOI:10.1109/IITC/MAM57687.2023.10154637

A. Zienert, Jan Langer, Doreen Hensel, L. Hofmann, K. Gottfried, J. Schuster

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引用次数: 1

摘要

我们提出了一种有效的算法来检测AFM图像中圆形过孔的阵列状图案。与简单的直观方法相比，它结合了Hough变换的新变体和暴力搜索的有效实现，以确保良好的结果和高性能。使用一组人工标记的基准数据来系统地评估准确性并改进算法。我们将新的孔检测方法应用于CMP后铜孔的AFM图像的碟形测量。

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Automatic Detection of Via Arrays in AFM Images for CMP Dishing Evaluation

We present an efficient algorithm for the detection of array-like patterns of circular vias in AFM images. It combines a new variant of the Hough transformation with an efficient implementation of brute-force search to ensure good results and high performance, compared to a simple intuitive approach. A set of manually labeled benchmark data is used to systematically evaluate the accuracy and improve the algorithm. We apply the new via detection method to measure dishing in AFM images of copper vias after CMP.

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来源期刊

2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM)

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