低功率0.1 /spl mu/m技术的铟注入再检验

P. Bouillon, F. Benistant, T. Skotnicki, G. Guégan, D. Roche, E. André, D. Mathiot, S. Tedesco, F. Martin, M. Heitzmann, M. Lerme, M. Haond
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引用次数: 13

摘要

在0.1 /spl mu/m的CMOS技术中使用铟进行NMOS通道掺杂进行了充分的重新考虑。我们第一次清楚地证明了室温载流子冻结是导致扩展电阻和SIMS测量值之间存在巨大差异的原因,但它并不影响掺杂铟的NMOSFET的工作。用铟作沟道掺杂制备了0.1 /spl μ m的纳米mos晶体管。短通道效应明显减弱,有效低场迁移率略有提高。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Re-examination of indium implantation for a low power 0.1 /spl mu/m technology
The use of indium for NMOS channel doping in a 0.1 /spl mu/m CMOS technology is fully re-considered. For the first time, we clearly demonstrate that the room temperature carrier freeze-out is responsible for large discrepancies between spreading resistance and SIMS measurements but that it does not affect Indium doped NMOSFET's operation. 0.1 /spl mu/m NMOS transistors have been fabricated using Indium for channel doping. A strong reduction in short channel effect and a slight improvement in the effective low-field mobility have been obtained.
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