{"title":"芯片元件的无铅焊料SAC 305的可靠性取决于各种因素","authors":"O. Russkikh, J. Šandera","doi":"10.1109/ESTC.2008.4684393","DOIUrl":null,"url":null,"abstract":"The paper gives results of practical tests concerning reliability of solder joints forged with the lead free solder SAC305. Various finishing, bending pads and methods of soldering were tested.","PeriodicalId":146584,"journal":{"name":"2008 2nd Electronics System-Integration Technology Conference","volume":"42 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2008-11-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":"{\"title\":\"Reliability of lead free solder SAC 305 for chip components depending on various factors\",\"authors\":\"O. Russkikh, J. Šandera\",\"doi\":\"10.1109/ESTC.2008.4684393\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The paper gives results of practical tests concerning reliability of solder joints forged with the lead free solder SAC305. Various finishing, bending pads and methods of soldering were tested.\",\"PeriodicalId\":146584,\"journal\":{\"name\":\"2008 2nd Electronics System-Integration Technology Conference\",\"volume\":\"42 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2008-11-21\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"5\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2008 2nd Electronics System-Integration Technology Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ESTC.2008.4684393\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2008 2nd Electronics System-Integration Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ESTC.2008.4684393","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Reliability of lead free solder SAC 305 for chip components depending on various factors
The paper gives results of practical tests concerning reliability of solder joints forged with the lead free solder SAC305. Various finishing, bending pads and methods of soldering were tested.
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