用有限元法和蒙特卡罗法进行了金属丝键合过程的概率设计

2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2010-04-26 DOI:10.1109/ESIME.2010.5464529

Huixian Wu, Yangjian Xu, L. Liang, Y. Liu, S. Martin

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引用次数: 4

摘要

本文采用响应面策略与蒙特卡罗随机模拟方法相结合的概率方法，实现了基于数值模拟的导线键合参数化研究。讨论了金属和层间介质(ILD)堆叠层中峰值应力值的分布概率，以及线键合结构中自由空气球半径、铝垫厚度和球键合高度的变化，并评估了输出性能对输入变量的敏感性。最后，确定了影响焊丝键合性能的主要因素。

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The probability design for wire bonding process by finite element and Monte Carlo method

In this paper, a numerical simulation-based parametric study on wire bonding is implemented by the probability method that combines the response surface strategy and the Monte Carlo random simulation method. The distribution probabilities of the peak stress values in metal and interlayer dielectric (ILD) stack layers are discussed with the variation of free air ball radius, Al pad thickness and ball bonding height in the wire bonding structure and the sensitivities of the output performances to the input variables are assessed. Finally, the major impact factors are determined for optimization of wire bonding.

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来源期刊

2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE)

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