沉积后退火对雾化学气相沉积法GaOx/Si结构电性能的影响

Hidenobu Mori, H. Yoshida
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引用次数: 0

摘要

研究了沉积后退火(PDA)对雾化学气相沉积(CVD)制备氧化镓(GaOx) /硅(Si)结构电学性能的影响。利用高-低频电容-电压(C-V)技术表征了有效固定电荷密度(Qeff)和界面阱密度(Dit)。利用XPS光谱测定了GaOx/Si结构的化学键态。结果表明,尽管在不同的PDA条件下,负Qeff几乎不变,但在H2气氛下,Dit有所降低。从XPS光谱的结果可以看出,Dit的降低是导致Si表面悬空键减少的原因。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Effect of Post Deposition Annealing on Electrical Properties of GaOx/Si structure by Mist Chemical Vapor Deposition Method
We studied the effect of post deposition annealing (PDA) on electrical properties of gallium oxide (GaOx) /silicon (Si) structure fabricated by mist chemical vapor deposition (CVD). The effective fixed charge density (Qeff) and the interfacial trap density (Dit) were characterized by a high-low frequency capacitance-Voltage (C-V) technique. The chemical-bonding states of the GaOx/Si structures were determined by the XPS spectra. As a result, although the negative Qeff was almost constant regardless of the PDA conditions, the Dit was decreased in H2 atmosphere. It was considered that the decreased in Dit is to contribute to the decrease in the dangling bonds on the Si surface form the results of the XPS spectra.
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