电子冷却用表面改性/微结构强化池沸腾传热研究进展

Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) Pub Date : 2004-12-08 DOI:10.1109/EPTC.2004.1396618

N. Khan, D. Pinjala, K. Toh

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引用次数: 39

摘要

电子冷却是微电子和微系统封装的一个重要方面。包括沸腾在内的液体冷却正成为高热流密度应用的主要技术。与沸腾有关的主要问题是沸腾开始时的壁温和临界热流密度。几十年来，强化传热一直是研究人员和实践者关注的问题。本文综述了用表面改性和微机械结构增强沸点的实验工作。分析了不同工艺的沸腾起始温度和临界热流密度。本文的目的是设计一种新的微机械结构，以提高沸腾和结构与芯片的集成，用于冷却3D堆叠模块。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Pool boiling heat transfer enhancement by surface modification/micro-structures for electronics cooling: a review

Electronics cooling is an important aspect of the microelectronics and microsystem packaging. Liquid cooling involving boiling is emerging as main technique for high heat flux application. Primary issues related to boiling are wall temperature over shoot at boiling incipience and critical heat flux. Heat transfer enhancement has concerned the researchers and practitioners for many decades. This paper reviews experimental works done for boiling enhancement by surface modification and micro-machined structures. Boiling incipient temperature and critical heat flux by various techniques are analyzed. Aim of this review is to design a novel micro-machined structure to enhance boiling and integration of the structure with the chip for cooling 3D stacked module.

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Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971)

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