初始通孔阻力与可靠性性能的相关性

C. Graas, H. A. Le, T.A. Rosi
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引用次数: 7

摘要

分别对w -塞通过链和Van der Pauw结构进行了加速应力和电迁移(EM)测试。这些种群的选择包括广泛分布的初始抗性R/sub 0/。R/sub 0/分布的高端在EM失效时间分布中表现出更高的早期故障率和更高的扩散。通过电阻分布产生严格控制的时间为零的工艺更适合于通过可靠性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Correlations between initial via resistance and reliability performance
Accelerated stressing and electromigration (EM) testing were conducted on W-plug via chains and Van der Pauw structures respectively. These populations were chosen to include a wide distribution of initial resistances R/sub 0/. The high-end of the R/sub 0/ distribution exhibited a higher early failure rate and a higher spread in EM time-to-fail distribution. Processes which produce tightly controlled time-zero via resistance distributions are more desirable for via reliability.
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