R. Shaviv, G. Harm, Sangita Kumari, R. Keller, D. Read
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Electromigration of Cu interconnects under AC, pulsed-DC and DC test conditions
Electromigration (EM) of a dual damascene, single-via fed test vehicle was measured using DC, AC followed by DC, and three rectangular-wave DC stressing conditions at 598 K. In some of the experiments samples were allowed to cool between stress cycles.
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