{"title":"短通道双栅器件阈值电压的物理紧凑模型","authors":"Keunwoo Kim, J. Fossum, C. Chuang","doi":"10.1109/SISPAD.2003.1233677","DOIUrl":null,"url":null,"abstract":"Compact physics/process-based model for threshold voltage in double-gate devices is presented. Drain-induced barrier lowering and short-channel-induced barrier lowering models for double-gate and bulk-Si devices are derived. The validity and predictability of the models are demonstrated and confirmed by numerical device simulation results for extremely scaled (L/sub eff/=25 nm) double-gate and bulk-Si devices.","PeriodicalId":220325,"journal":{"name":"International Conference on Simulation of Semiconductor Processes and Devices, 2003. SISPAD 2003.","volume":"39 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2003-09-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"22","resultStr":"{\"title\":\"Physical compact model for threshold voltage in short-channel double-gate devices\",\"authors\":\"Keunwoo Kim, J. Fossum, C. Chuang\",\"doi\":\"10.1109/SISPAD.2003.1233677\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Compact physics/process-based model for threshold voltage in double-gate devices is presented. Drain-induced barrier lowering and short-channel-induced barrier lowering models for double-gate and bulk-Si devices are derived. The validity and predictability of the models are demonstrated and confirmed by numerical device simulation results for extremely scaled (L/sub eff/=25 nm) double-gate and bulk-Si devices.\",\"PeriodicalId\":220325,\"journal\":{\"name\":\"International Conference on Simulation of Semiconductor Processes and Devices, 2003. SISPAD 2003.\",\"volume\":\"39 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2003-09-29\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"22\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"International Conference on Simulation of Semiconductor Processes and Devices, 2003. SISPAD 2003.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SISPAD.2003.1233677\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Conference on Simulation of Semiconductor Processes and Devices, 2003. SISPAD 2003.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SISPAD.2003.1233677","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Physical compact model for threshold voltage in short-channel double-gate devices
Compact physics/process-based model for threshold voltage in double-gate devices is presented. Drain-induced barrier lowering and short-channel-induced barrier lowering models for double-gate and bulk-Si devices are derived. The validity and predictability of the models are demonstrated and confirmed by numerical device simulation results for extremely scaled (L/sub eff/=25 nm) double-gate and bulk-Si devices.