键合SOI晶圆颜色变化分析

Proceedings of 1993 IEEE International SOI Conference Pub Date : 1993-10-05 DOI:10.1109/SOI.1993.344589

P. Clapis, A. Ledger, K. Daniell

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引用次数: 1

摘要

在本文中，我们分析了为什么SOI晶圆呈现为肉眼所见的样子。我们展示了小至10埃的厚度变化如何引起易于识别的颜色变化，以及为什么这种光学效应在薄SOI晶圆中比在氧化涂层晶圆或厚SOI晶圆中强得多。

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Analysis of color variation in bonded SOI wafers

In this paper, we analyze why SOI wafers appear as they do to the naked eye. We show how a thickness variation as small as ten Angstroms can cause a readily discernible color change, and why this optical effect is much stronger in a thinned SOI wafer than in an oxide-coated wafer or in thick SOI wafers.<>

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Proceedings of 1993 IEEE International SOI Conference

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