衬底注入引起的程序扰动——闪存eprom阵列可靠性的新考虑

A. Roy, R. Kazerounian, A. Kablanian, B. Eitan
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引用次数: 11

摘要

高密度闪存eprom的发展正朝着可扩展性、扇区擦除和仅5v操作的方向发展。对于利用通道热电子注入进行编程的闪存概念,报道了一种新的由热电子注入衬底引起的扰动机制。这种机制在沿着同一位线的其他位的编程周期中干扰擦除调用。flash eprom的高温编程要求通过衬底中热生成电子的强烈增加而急剧增强了扰动。该程序扰动通过扰动时间的增加对面向字线的扇区擦除存储器结构的影响最大。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Substrate injection induced program disturb-a new reliability consideration for flash-EPROM arrays
The development of high-density flash EPROMs is being directed towards scalability, sector erase, and 5-V-only operation. For the flash concepts that are utilizing channel hot electron injection for the programming, a new disturbance mechanism caused by substrate injection of thermally generated electrons is reported. This mechanism disturbs an erased call during programming cycles of other bits along the same bitline. The high-temperature programming requirement for flash EPROMs drastically enhances the disturbance through the strong increase in thermally generated electrons in the substrate. This program disturbance has the greatest impact on the wordline oriented sector erase memory architectures, through the increase in disturbance time.<>
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