{"title":"差分分析在纳米探测技术中对集成电路不稳定缺陷进行推理的应用","authors":"G. Shen, K. Chuang","doi":"10.1109/IPFA.2006.250984","DOIUrl":null,"url":null,"abstract":"The purpose of this paper is to present a novel deductive methodology, which is accomplished by applying difference analysis to nano-probing technique. This methodology would like to resolve the erratic device with a tailing failure or puzzling feature, but not only to check if the suspect had incorrect characteristic or mismatched transistor parameters","PeriodicalId":283576,"journal":{"name":"2006 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits","volume":"12 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-07-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Apply Difference Analysis to Nano-Probing Technique for Reasoning Erratic Defect out in Integrated Circuits\",\"authors\":\"G. Shen, K. Chuang\",\"doi\":\"10.1109/IPFA.2006.250984\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The purpose of this paper is to present a novel deductive methodology, which is accomplished by applying difference analysis to nano-probing technique. This methodology would like to resolve the erratic device with a tailing failure or puzzling feature, but not only to check if the suspect had incorrect characteristic or mismatched transistor parameters\",\"PeriodicalId\":283576,\"journal\":{\"name\":\"2006 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits\",\"volume\":\"12 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2006-07-03\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2006 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IPFA.2006.250984\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2006 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA.2006.250984","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Apply Difference Analysis to Nano-Probing Technique for Reasoning Erratic Defect out in Integrated Circuits
The purpose of this paper is to present a novel deductive methodology, which is accomplished by applying difference analysis to nano-probing technique. This methodology would like to resolve the erratic device with a tailing failure or puzzling feature, but not only to check if the suspect had incorrect characteristic or mismatched transistor parameters