加速测试结果和现场建模的可靠性和风险评估:汽车模拟部件和传感器分层问题案例研究

2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Pub Date : 2016-07-18 DOI:10.1109/IPFA.2016.7564314

C. Bergès, A. Feybesse, W. A. R. Othman

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引用次数: 2

摘要

对于汽车半导体行业的风险评估，虽然典型的现场建模使用故障里程，但对于模拟和传感器产品的分层问题，采用了一种新的基于时间的方法。它强调了与失效分析结论和产品生命周期的两个阶段相一致的双峰性。每个冲击晶圆的建模允许揭示某些晶圆的特定轮廓。对可靠性温湿度偏差(THB)试验结果进行了建模，并与现场建模进行了比较。

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Reliability and risk assessment from accelerated test result and field modeling: Delamination issue case study for automotive analog parts and sensors

For risk assessments in automotive semiconductor industry, while a typical field modeling uses failure mileages, a new time-based approach was implemented for a delamination issue on analog and sensor products. It highlighted a bimodality coherent with the failure analysis conclusions and with the two phases in the product life. Modeling per impacted wafer allowed to reveal specific profiles for some wafers. Modeling on Reliability Temperature Humidity Bias (THB) test results was also performed and compared to the field modeling.

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2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

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