{"title":"130nm ASIC技术中的CDM失效模式","authors":"C. Brennan, J. Sloan, D. Picozzi","doi":"10.1109/EOSESD.2004.5272610","DOIUrl":null,"url":null,"abstract":"CDM failures in I/O cells in a 130 nm CMOS ASIC technology are studied. Most failures occurred in internal circuits that were not connected to chip pads. The failures correlate to the I/O power supply network resistance at the I/O cells. Failure modes include gate oxide ruptures on internal nodes driven by active circuits.","PeriodicalId":302866,"journal":{"name":"2004 Electrical Overstress/Electrostatic Discharge Symposium","volume":"62 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2004-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"25","resultStr":"{\"title\":\"CDM failure modes in a 130nm ASIC technology\",\"authors\":\"C. Brennan, J. Sloan, D. Picozzi\",\"doi\":\"10.1109/EOSESD.2004.5272610\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"CDM failures in I/O cells in a 130 nm CMOS ASIC technology are studied. Most failures occurred in internal circuits that were not connected to chip pads. The failures correlate to the I/O power supply network resistance at the I/O cells. Failure modes include gate oxide ruptures on internal nodes driven by active circuits.\",\"PeriodicalId\":302866,\"journal\":{\"name\":\"2004 Electrical Overstress/Electrostatic Discharge Symposium\",\"volume\":\"62 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2004-09-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"25\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2004 Electrical Overstress/Electrostatic Discharge Symposium\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EOSESD.2004.5272610\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2004 Electrical Overstress/Electrostatic Discharge Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EOSESD.2004.5272610","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
CDM failures in I/O cells in a 130 nm CMOS ASIC technology are studied. Most failures occurred in internal circuits that were not connected to chip pads. The failures correlate to the I/O power supply network resistance at the I/O cells. Failure modes include gate oxide ruptures on internal nodes driven by active circuits.
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