为后端流程的设备和集群提供了新的架构

M. Lichtveld, B. van der Zon
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引用次数: 2

摘要

多年来,半导体后端制造已经呈现出流程和设备自动化和集成的趋势。要实现的目标是众所周知的:缩短周期时间,在制品物料处理,提高设备利用率等等。设备制造商和集成商面临的挑战是最大限度地提高功能和灵活性,同时最大限度地降低复杂性和成本。虽然设备制造商必须处理上市时间短和在其设备中集成新工艺的困难,但集成商面临着设备制造商对标准解释的差异。所有这些问题都可以通过不同的系统架构和设计方法来解决。本文为半导体后端工业中的设备和集群提供了一种新的系统架构和设计方法。由于过程集成和设备集成之间没有根本的区别,因此可以使用相同的通用组件(机械,电气和软件)来构建设备或集群。最后,本文展示了该系统架构如何应用于独立设备设计以及集群设计。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A new architecture for equipment and clusters for backend processes
For years, semiconductor backend manufacturing has shown a trend for automation and integration of processes and equipment. The goals to be achieved are well known: reduction of cycle time, WIP material handling, and improvement of equipment utilization to name a few. The challenges for equipment manufacturers and integrators are maximizing functionality and flexibility, while minimizing complexity and cost. While equipment manufacturers must deal with short time-to-market and difficulties of integrating new processes in their equipment, integrators are confronted with differences in interpretation of standards by equipment manufacturers. All these problems can be tackled by a different approach to system architecture and design. This paper presents such a new approach to system architecture and design for equipment and clusters in the semiconductor backend industry. Because no fundamental differentiation is made between process integration and equipment integration, the same generic components (mechanical, electrical and software) can be used to build-equipment or clusters. Finally, this paper shows how this system architecture can be applied in the design of standalone equipment as well as in the design of clusters.
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