低功耗嵌入式存储器设计过程对系统级的考虑

E. Terzioglu, S. Yoon, C. Jung, Ritu Chaba, Venu Boynapalli, M. Abu-Rahma, Joseph Wang, Sam Yang, G. Nallapati, A. Thean, C. Chidambaram, M. Han, G. Yeap, M. Sani
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引用次数: 2

摘要

嵌入式存储器广泛应用于低功耗片上系统(SoC)应用。低功耗性能可以通过工艺、电路、架构和系统级的协同开发来优化。本文描述了先进技术节点的低功耗设计考虑,以解决内存泄漏和有源功耗问题。描述了过程技术定义背景下的内存位单元设计、宏观设计层面的电路技术以及低功耗的芯片级集成考虑。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Low power embedded memory design – process to system level considerations
Embedded memories are widely used in low power System-on-Chip (SoC) applications. Low power performance can be optimized with process, circuits, architecture and system level co-development. In this paper, low power design considerations are described in advanced technology nodes to address memory leakage and active power dissipation. Memory bit cell design in context of process technology definition, circuit techniques at the macro design level, and chip-level integration considerations for low power are described.
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