Evolution of Anand Parameters With Elevated Temperature Aging for SAC Leadfree Alloys

Electronic equipment in automotive, agricultural and avionics applications may be subjected to temperatures in the range of −55 to 200°C during storage, operation and handling in addition to high strain-rates. Strain rates in owing to vibration and shock may range from 1–100 per sec. Temperature in electronic assemblies depends typically on location, energy dissipation and thermal architecture. Some investigators have indicated that the required operating temperature is between −40 to 200°C for automotive electronics located underhood, on engine, on transmission. Prior data indicates the evolution of mechanical properties under extended exposures to high temperatures. However, the constitutive models are often only available for pristine materials only. In this paper, effect of low operating temperatures (−65°C to 0°C) on Anand-model parameters at high strain rates (10–75 per sec) for aged SAC (SAC105 and SAC-Q) solder alloys has been studied. Stress-Strain curves have been obtained at low operating temperatures using tensile tests. The SAC leadfree solder samples were subjected to isothermal-aged up to 4-months at 50°C before testing. Anand Viscoplastic model has been used to describe the material constitutive behavior. Evolution of Anand Model parameters for SAC solder has been investigated. The computed parameters of the experimental data were used to simulate the tensile test and verified the accuracy of the model. A good correlation was found between experimental data and Anand predicted data.