用试验结构和良率模型评价金属化系统

ICMTS 93 Proceedings of the 1993 International Conference on Microelectronic Test Structures Pub Date : 1993-03-22 DOI:10.1109/ICMTS.1993.292891

C. A. DeLoach, H. Parks, S. Beck

{"title":"用试验结构和良率模型评价金属化系统","authors":"C. A. DeLoach, H. Parks, S. Beck","doi":"10.1109/ICMTS.1993.292891","DOIUrl":null,"url":null,"abstract":"Comb test structures are used to evaluate three metal systems for IC use. Defects are analyzed based on density alone using a simple noncluster Poisson yield model and for clustering as well as using a negative binomial yield model. Results show that to accurately evaluate the highest yielding metal system at VLSI chip sizes, defects must be separated by type and evaluated in terms of clustering as well as defect density.<<ETX>>","PeriodicalId":123048,"journal":{"name":"ICMTS 93 Proceedings of the 1993 International Conference on Microelectronic Test Structures","volume":"25 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1993-03-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Evaluation of metallization systems with test structures and yield modeling\",\"authors\":\"C. A. DeLoach, H. Parks, S. Beck\",\"doi\":\"10.1109/ICMTS.1993.292891\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Comb test structures are used to evaluate three metal systems for IC use. Defects are analyzed based on density alone using a simple noncluster Poisson yield model and for clustering as well as using a negative binomial yield model. Results show that to accurately evaluate the highest yielding metal system at VLSI chip sizes, defects must be separated by type and evaluated in terms of clustering as well as defect density.<<ETX>>\",\"PeriodicalId\":123048,\"journal\":{\"name\":\"ICMTS 93 Proceedings of the 1993 International Conference on Microelectronic Test Structures\",\"volume\":\"25 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1993-03-22\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"ICMTS 93 Proceedings of the 1993 International Conference on Microelectronic Test Structures\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICMTS.1993.292891\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"ICMTS 93 Proceedings of the 1993 International Conference on Microelectronic Test Structures","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICMTS.1993.292891","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 1

摘要

梳状测试结构用于评估三种用于集成电路的金属系统。采用简单的非聚类泊松产率模型和负二项产率模型对缺陷进行了密度分析。结果表明，为了准确地评估VLSI芯片尺寸下最高产量的金属体系，必须按类型分离缺陷，并根据聚类和缺陷密度进行评估。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Evaluation of metallization systems with test structures and yield modeling

Comb test structures are used to evaluate three metal systems for IC use. Defects are analyzed based on density alone using a simple noncluster Poisson yield model and for clustering as well as using a negative binomial yield model. Results show that to accurately evaluate the highest yielding metal system at VLSI chip sizes, defects must be separated by type and evaluated in terms of clustering as well as defect density.<>

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

ICMTS 93 Proceedings of the 1993 International Conference on Microelectronic Test Structures

自引率

0.00%

发文量